Application · LED and power modules
LED strips and power modules.
For LED packaging, the AW-ZP04A runs 4 lanes × 8 strips at about 800 strips per hour, and the AW-ZMP microwave cleaner treats strips without an electrode in the chamber. In IGBT modules, plasma prepares chips and substrates before wire bonding and before potting.
Two lines
Where plasma goes.
LED PACKAGING
Before the wire, in the reflector cup.
Plasma cleans the lead frame and the chip before LED wire bonding, so the wire bonds reliably and the encapsulant adheres.
- AW-ZP04A: strips L 105–155 × W 30–80 mm, 4 lanes × 8 strips, UPH ~800
- AW-ZMP04: microwave, no internal electrode, strips L 150–260 × W 30–80 mm
IGBT · DBC / AMB
Before the aluminum wire and the gel.
In IGBT and DBC / AMB power modules, plasma sits after die attach and sintering, ahead of wire bonding — and after bonding, ahead of potting with silicone gel.
- Before heavy-wire bonding on DBC substrates
- Before potting, for better gel adhesion
- Batch chambers for large substrates and fixtures
- In line: AW-ZP04B on IGBT module lines, before wire bonding
Matched to the line.
AW-ZP04A · in-line RF
Set up for LED packaging: 4 lanes × 8 strips, UPH ~800.
AW-ZP
AW-ZMP04 · in-line microwave
No internal electrode; uniform, gentle cleaning without ESD trouble.
AW-ZMP
AW-MP60 · chamber microwave
Batch microwave cleaning with a rotating tray, 400 × 400 × 400 mm chamber.
AW-MP
AW-LP01 · continuous RF
Tray transfer, linked to the tools before and after it.
AW-LPLED strip or power module?
Send the substrate, part size and the step that follows. We recommend in-line or batch, and the source that suits it.
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