AW-P Chamber RF Plasma Cleaner
The AW-P series treats trays, fixtures and larger parts in batches. Parallel or grid electrodes adjust in spacing to the workpiece, and every process parameter can be set, changed and monitored online.
Features
- Compact structure with a small footprint
- Good vacuum tightness for a stable cleaning result
- Parallel or grid electrodes with adjustable spacing to suit the workpiece
- Multiple recipes stored and recalled in one step
- Full process control: set, modify and monitor parameters online
- Interlocks, fault alarms and real-time monitoring
- Shielding at the rear of the chamber against electromagnetic radiation
- Optional automatic door for later automation
| Parameter | AW-P100 | AW-P135 | AW-P170 |
|---|---|---|---|
| Plasma source | 13.56 MHz RF, automatic impedance matching | ||
| RF power | 0–600 W / 1000 W, adjustable | ||
| Chamber | L 500 × W 500 × H 400 mm, stainless steel or aviation aluminum | L 600 × W 500 × H 450 mm | L 540 × W 530 × H 600 mm |
| Electrodes | Multi-layer parallel electrodes, single-layer effective area L 450 × W 450 mm | Nine-grid multi-layer electrodes | Four-grid multi-layer electrodes |
| Vacuum pump | Vacuum oil pump, dry pump optional | Roots pump set | Roots pump set |
| Gas system | 2 lines as standard; O2 / Ar / H2 / N2 / CF4, mass-flow controlled, 0–200 mL/min; polished stainless-steel lines | ||
| Control | Touchscreen + PLC, manual and automatic modes; optional industrial PC for MES connection | ||
| Dimensions | L 1000 × W 950 × H 1950 mm, including signal tower | L 1200 × W 1350 × H 1950 mm, including signal tower | L 1130 × W 1400 × H 2090 mm, including signal tower |
Specifications from the current Awing product literature. Confirm the configuration for your process in the quotation.
Batch cleaning and activation of parts on trays and fixtures, for mixed products and larger pieces.
Related pages
Semiconductor packaging · LED / IGBT packaging
Selection guides
RF vs Microwave · Inline vs Chamber · Test & verification methods
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