AW-QP Single-Wafer Plasma Descum System
The AW-QP600 strips photoresist from single wafers of 4, 6 and 8 inches, and handles plasma surface cleaning and descum before etching. It serves chip manufacturing, MEMS, solar cells, compound semiconductors (GaAs, GaN, GaP, InP, SiC) and optoelectronics.
Features
- Photoresist strip (ashing) for 4-, 6- and 8-inch wafers
- Controlled photoresist removal (descum) before etching
- Strip and descum of GaAs and InP wafers
- Plasma surface cleaning
- Flexible or multi-chamber design to customer requirements
| Parameter | AW-QP600 |
|---|---|
| Plasma source | 13.56 MHz RF, automatic impedance matching |
| RF power | 0–600 W, adjustable |
| Wafer size | 4, 6 and 8 inch |
| Strip rate | 300–1500 Å/min |
| Temperature control | 30–160 °C, ±3 °C |
| Throughput and breakage | Single chamber 45–60 wafers/hour; breakage ≤ 1/1000 |
| Chamber material | Quartz + 6061 aluminum alloy |
| Vacuum system | Oil or dry pump; imported pneumatic angle valve and vent valve; high-precision vacuum gauge |
| Gas system | Mass-flow controllers, 2 lines as standard: 5 SLM O2 and 1 SLM N2 |
| Control | Touchscreen industrial PC + PLC |
| Dimensions | L 1200 × W 1500 × H 1750 mm, excluding signal tower |
Specifications from the current Awing product literature. Confirm the configuration for your process in the quotation.
Photoresist strip and descum in chip manufacturing, MEMS, solar cells, compound semiconductors and optoelectronics.
Related pages
Semiconductor packaging · Test & verification methods
Selection guides
RF vs Microwave · Inline vs Chamber · Test & verification methods
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