

AW-ZP In-line RF Plasma Cleaner
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The AW-ZP series cleans lead-frame strips in line with your packaging process. Automatic pick, transfer and delivery are designed around the lead frame, and the transfer handles strips of uneven stiffness without jamming. Choose the ZP04B for IC packaging or the ZP04A for LED packaging.
Features
- Short cleaning time, without sputtering or high-temperature damage
- Designed for lead frames, with automatic pick, transfer and delivery
- Transfer structure that prevents jams and damage from strips of uneven stiffness
- Automatic changeover for different incoming strips
- Same-side or left-in / right-out loading, reducing handling and secondary contamination
- Animated display of the whole line, with real-time process monitoring
- Fault alarm that names the fault item and the station
- Tiered parameter access for safer operation
- Optional MES data transmission
Certification: CE certificate of conformity for the AW-ZP in-line series, including AW-ZP04B and AW-ZP04A (Low Voltage Directive 2014/35/EU, EMC Directive 2014/30/EU, Machinery Directive 2006/42/EC).
| Parameter | AW-ZP04B | AW-ZP04A |
|---|---|---|
| Plasma source | 13.56 MHz RF, automatic impedance matching | |
| RF power | 0–600 W / 1000 W, adjustable | |
| Strip size | L 150–300 × W 30–100 mm | L 105–155 × W 30–80 mm |
| Throughput | 4 lanes × 4 strips, UPH > 500 | 4 lanes × 8 strips, UPH ~800 |
| Reaction chamber | L 550 × W 320 × H 50 mm, aluminum alloy | L 450 × W 350 × H 50 mm, aluminum alloy |
| Process gas | O2 / Ar / H2, mass-flow controlled, 0–200 mL/min | |
| Control | Touchscreen + PLC, manual and automatic modes; optional industrial PC for MES connection | |
| Dimensions | L 1700 × W 1100 × H 1950 mm, including signal tower | |
| Target process | IC packaging | LED packaging |
Specifications from the current Awing product literature. Confirm the configuration for your process in the quotation.
Plasma cleaning of lead-frame strips before wire bonding and before molding, in IC and LED packaging lines.
Related pages
Semiconductor packaging · LED / IGBT packaging
Selection guides
RF vs Microwave · Inline vs Chamber · Test & verification methods
Request a quotation.
Send the part size, target UPH and how the system joins your line. An engineer replies with the configuration and what else we need to quote.

Plasma cleaning and surface activation systems, engineered and built in Wuxi, China.
awingtech@wxawing.comInquiry
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