

AW-LP Continuous RF Plasma Cleaner
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The AW-LP01 moves parts through the plasma chamber on carrier trays and connects directly to the equipment before and after it — left-in / right-out or right-in / left-out — for a highly automated line.
Features
- Left-in / right-out or right-in / left-out, for direct connection to up- and downstream equipment
- Short cleaning time, without sputtering or high-temperature damage
- MES data transmission
- Tiered parameter access for safer operation
- Animated display of the whole line, with real-time process monitoring
- Automatic changeover for different incoming parts
| Parameter | AW-LP01 |
|---|---|
| Plasma source | 13.56 MHz RF, automatic impedance matching |
| RF power | 0–600 W / 1000 W, adjustable |
| Chamber | L 350 × W 350 × H 70 mm |
| Tray size | L 200 × W 120 × H 20 mm, adjustable to customer requirements |
| Vacuum system | Oil or dry pump; imported pneumatic angle valve and vent valve; high-precision vacuum gauge |
| Gas system | Mass-flow controlled, 0–200 mL/min; polished stainless-steel gas lines and fittings |
| Control | Touchscreen + PLC, manual and automatic modes; optional industrial PC for MES connection |
| Dimensions | L 1200 × W 1000 × H 1800 mm, excluding signal tower |
Specifications from the current Awing product literature. Confirm the configuration for your process in the quotation.
Continuous plasma cleaning where parts travel on trays between process steps and the cleaner links directly to the tools before and after it.
Related pages
Semiconductor packaging · LED / IGBT packaging
Selection guides
RF vs Microwave · Inline vs Chamber · Test & verification methods
Request a quotation.
Send the part size, target UPH and how the system joins your line. An engineer replies with the configuration and what else we need to quote.

Plasma cleaning and surface activation systems, engineered and built in Wuxi, China.
awingtech@wxawing.comInquiry
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Fields marked * are required. Details about the part, the material and the process help an engineer give a useful first reply.
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