The 8th China Semiconductor Equipment Annual Conference will be held in Hefei on October 28-30

Conference agenda

Sharing industry information, industry updates, development trends and solutions with you: sharing together, and growing together every step of the way

• 2020-10-28

  Conference check-in

• 2020-10-29

  Summit forum

  October 29, 2020 Thursday

  Venue: International Hall B, 3rd Floor, Hefei Fengda International Hotel

  Summit forum
  Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
  Time	Topic
  09:00-09:10	Addresses by leaders
  	Provincial and municipal leaders Ye Tianchun, President of the Institute of Integrated Circuit Innovation, Chinese Academy of Sciences (in preparation); Chief Technical Expert of National Science and Technology Major Project 02; Vice Chairman of the China Semiconductor Industry Association Jin Lei, Director of the Basic Products Division, Department of Electronic Information, Ministry of Industry and Information Technology
  09:10-09:25	Presentation on Hefei's investment environment and the Integrated Circuit Industrial Park of the Hefei Economic and Technological Development Zone
  	Chen Nana, Investment Promotion Bureau, Hefei Economic and Technological Development Zone
  09:25-09:30	Unveiling ceremony of the Hefei Semiconductor High-end Equipment and Components Industrial Park
  09:30-09:35	Group signing ceremony for Hefei semiconductor projects
  Invited presentations
  09:35-09:55	China's semiconductor equipment: review and outlook
  	Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
  09:55-10:15	(Topic to be confirmed)
  	Dr. Wang Houliang, Party Secretary and Executive Deputy General Manager, ChangXin Memory Technologies, Inc.
  10:15-10:30	Tea break and exhibition networking
  10:30-10:50	Moving forward together to build a semiconductor equipment industry ecosystem
  	Zhou Yang, Vice President, Beijing NAURA Microelectronics Equipment Co., Ltd.
  10:50-11:10	Discussion of several strategic issues in accelerating the development of the semiconductor equipment industry
  	Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China
  11:10-11:30	Opportunities and challenges of III-V nitride epitaxy technology
  	Dr. Hao Maosheng, General Manager, Shanghai Xinyuanji Semiconductor Technology Co., Ltd.
  11:30-11:50	(Topic to be confirmed)
  	Zhang Yue, Founder and Chairman, Hefei Yuexin Technology Co., Ltd.
  11:50-12:10	Development trends and outlook of China's semiconductor equipment industry
  	Wang Hui, President of the Semiconductor Equipment Branch, China Electronics Production Equipment Industry Association; Chairman, ACM Research (Shanghai), Inc.
  12:10-13:20	Buffet lunch
  Moderator: Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China
  13:20-13:40	HYBRID BONDING SOLUTION: hybrid bonding, a solution for heterogeneous packaging
  	Gong Li, General Manager China, SUSS
  13:40-14:00	Water quality analysis and control for wet process equipment
  	Ma Tan, Sales Manager, Microelectronics Industry, METTLER TOLEDO
  14:00-14:20	Joint development model for international high-precision nm-scale semiconductor equipment, and experience sharing
  	Dr. Zeng Xu, Vice President, Asia-Pacific Semiconductor Division, Jiangsu Jicui Sukesi Technology Co., Ltd.
  14:20-14:40	Domestic production of semiconductor packaging dicing technology
  	Qian Lixin, Deputy General Manager, Advanced Microelectronic Equipment (Zhengzhou) Co., Ltd.
  14:40-15:00	A new model for R&D collaboration on equipment and materials in the More than Moore field
  	Feng Li, Deputy General Manager, Shanghai Industrial Microtechnology Research Institute
  15:00-15:20	Introduction to flowmeters for semiconductor equipment
  	Yang Changlin, Department Manager, Tokyo Keiso Co., Ltd.; General Manager, Tokyo Keiso (Beijing) Instruments Co., Ltd.
  15:20-15:40	Tea break and exhibition networking
  15:40-16:00	Micro-electromechanical casting: a clean, efficient wafer-level thick metal deposition technology
  	Dr. Gu Jiebin, CEO, Shanghai Maizhu Semiconductor Technology Co., Ltd.; Associate Research Fellow, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
  16:00-16:20	Advanced packaging innovations in communication networks and the mobile internet
  	Li Bin, General Manager China, Besi
  16:20-16:40	Current status and future technology roadmap of domestic semiconductor packaging equipment
  	Fang Tangli, Manager, Semiconductor Technology Department, Anhui Naike Equipment Technology Co., Ltd.
  16:40-17:00	Interpretation of the insurance compensation policy for first-of-its-kind (first unit/set) major technical equipment
  	Yue Wei, Product Director, Special Risks Department, Ping An Property & Casualty Insurance Company of China, Ltd.
  17:00-17:20	Some insights from developing core components for domestic IC equipment
  	Yan Yue, General Manager, Shanghai Jijia Electronic Technology Co., Ltd.
  17:20-17:40	(Topic to be confirmed)
  	Tongfu Microelectronics Co., Ltd.
  18:10-20:30	Reception dinner. Supported by: Shanghai Micro Electronics Equipment (Group) Co., Ltd.

• 2020-10-30

  Thematic forum

  October 30, 2020 International Hall B, 3rd Floor, Hefei Fengda International Hotel

  Thematic forum on the coordinated development of the semiconductor equipment industry chain
  Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
  9:00-9:25	Shuoke Zhongkexin full-range ion implanter solutions
  	Zeng Ansheng, Marketing and Process Director, Beijing Shuoke Zhongkexin Electronics Equipment Co., Ltd.
  9:25-9:50	Applications of transparent anti-static resin sheets in electronic engineering
  	Zhang Jingchun, Chief Technical Engineer, Suzhou Fulang Optical Materials Co., Ltd.; Member, China Electrostatic Standardization Committee
  9:50-10:15	Win-win cooperation to create core value: power supply trends for semiconductor equipment and high-reliability power supply application cases
  	Yuan Chong, Marketing Manager, TDK-Lambda (China) Electronics Co., Ltd.
  10:15-10:35	Tea break and exhibition networking
  10:35-10:50	Opportunities and challenges for domestic semiconductor equipment
  	Jiang Tingming, Vice President, Shanghai Zhichun Technology
  10:50-11:15	Domestic production of key equipment for IC advanced packaging
  	Dr. Ye Lezhi, Senior Engineer and Technical Director, Beijing CETC Electronic Equipment Co., Ltd.
  11:15-11:40	Research on diamond-based composite materials for chip thermal management
  	Li Zhengxian, Chairman, Shanghai Zhuojing Semiconductor Technology Co., Ltd.
  11:40-12:05	Progress in the domestic production of large-size fully automatic precision dicing equipment
  	Yang Yunlong, Chairman and President, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
  12:05-13:30	Buffet lunch
  13:30-13:55	DISCO DIS100 fully automatic chip inspection system
  	Shu Yayun, Product Manager, DISCO Technology (China) Co., Ltd.
  13:55-14:20	Opportunities and challenges for high-volume manufacturing (HVM) semiconductor inspection and metrology equipment
  	Dr. Zhang Xuena, Chairman and General Manager, Beijing Aixin Semiconductor Technology Co., Ltd.
  14:20-14:45	The urgency of industry-university-research-user collaboration for a self-reliant, controllable Chinese semiconductor equipment industry
  	Wang Chi, Chairman/Founder, Suzhou Aikeruisi Intelligent Equipment Co., Ltd.
  14:45-15:10	Challenges facing failure analysis as advanced integrated circuits develop
  	Dr. Chen Zhirong, Assistant Vice President, Engineering Division, Weisibo Testing Technology (Hefei) Co., Ltd.
  15:10-15:35	Tea break and exhibition networking
  15:35-15:50	Market applications of new electronic devices, and lithography-area (yellow light) wet process equipment
  	Wang Gang, General Manager, Ningbo Runhua Quanxin Microelectronics Equipment Co., Ltd.
  15:50-16:15	Applications of PSP 3D imaging and AI vision technology in the semiconductor packaging industry
  	Lin Guicheng, Sales Director, Hefei Tuxun Electronic Technology Co., Ltd.
  16:15-16:40	Latest business developments of global semiconductor equipment companies
  	Yang Shaohui, Chief Analyst, Research Department, BOC International Securities