Cleaning effect of plasma cleaners on copper lead frames

To ensure the reliability of copper lead frames (i.e. copper brackets) during wire bonding and molding and to improve yield, plasma cleaners are usually used to plasma-clean copper lead frames. The effectiveness of plasma treatment is affected by multiple factors. In the past, attention has mostly focused on the copper lead frames themselves and on the plasma cleaner selected and its parameters, but in fact several aspects of the magazine itself can also have a considerable impact on plasma treatment results.

1. Size and specifications

Copper lead frames of different sizes and specifications are used with magazines of different sizes, and magazine size has a certain bearing on plasma cleaning results. Generally speaking, the larger the magazine, the longer it takes for the plasma to get inside it, which affects the uniformity and effectiveness of the plasma treatment.

2) Spacing

Spacing here mainly refers to the distance between the layers of copper lead frames. The smaller the spacing, the poorer the effectiveness and uniformity of plasma cleaning of the copper lead frames.

3) Slot characteristics

When copper lead frames are placed in a magazine for plasma cleaning, if none of the four sides is slotted, the frames will be shielded and it will be difficult for the plasma to get in, affecting the treatment results. At the same time, the shielding effect, the position of the slots and the size of the slots also need to be considered.

In addition, whether the magazine lid should be closed, and when it should be closed, both affect plasma cleaning results.