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For in-line plasma cleaners, packaging quality directly affects the cost and performance of electronic products. In IC packaging, about 1/4 of device failures are related to contaminants on material surfaces, so addressing contaminants such as microparticles and oxide layers during packaging and improving packaging quality has become especially important. Electronic products and systems are developing toward portability, miniaturization and high performance. Processor chips run at ever higher internal frequencies, their functions keep growing more powerful, pin counts keep increasing, chip feature sizes keep shrinking, and package outline dimensions keep changing. Packaging has become as important as the chip itself: packaging quality directly affects chip performance as well as the design and manufacture of the PCB connected to it. The long-term reliability of IC packaged devices depends mainly on chip interconnection technology; inspection and analysis show that about 25% of device failures are caused by poor chip interconnection. For in-line plasma cleaners, failures caused by chip interconnection mainly take the form of non-stick wire bonds, delamination, wire deformation and damage caused by excessive bonding pressure, and bond spacing that is too small and prone to short circuits. These failure modes are all related to contaminants on material surfaces, mainly microparticles, thin oxide layers and organic residues. In-line plasma cleaning technology offers an environmentally friendly and effective solution, and has become indispensable key equipment and a key process in highly automated packaging processes.

After cleaning with a plasma cleaner, the cleaned object is already completely dry and can be sent to the next process without drying. Plasma cleaners do not use ODS harmful solvents such as trichloroethylene, and no harmful pollutants are produced after cleaning, making plasma cleaning a green cleaning method that benefits environmental protection. A plasma cleaner can penetrate tiny holes and recesses in an object to complete the cleaning task, without much concern for the shape of the object being cleaned. The entire cleaning process can be completed within a few minutes, so it is highly efficient. A characteristic of plasma cleaners is that they can treat different substrates, whatever the object being treated. Metals, semiconductors, oxides and polymer materials (such as polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyimide, polyester, epoxy resin and other polymers) can all be treated well with plasma. It is therefore particularly suitable for substrates that are not resistant to heat or solvents. It can also selectively clean the whole of a material, a local area of it, or complex structures. While cleaning and decontaminating, a plasma cleaner can also modify the surface properties of the material itself, for example by improving surface wettability and film adhesion. Plasma cleaners have high-precision control devices with very high time-control precision. Correct plasma cleaning does not create a damaged layer on the surface, ensuring surface quality. Because the process takes place in a vacuum, it does not pollute the environment and ensures that the cleaned surface is not subject to secondary contamination. Because plasma contains active particles such as electrons, ions and free radicals, it readily reacts with solid surfaces. Plasma cleaning mainly relies on the “activation” of active particles in the plasma to remove stains from the object surface. A plasma cleaner consists of a reaction chamber, a power supply and a vacuum pump set. The sample is placed in the reaction chamber, and the vacuum pump begins pumping down to a certain vacuum level. The power supply is then started to generate plasma, and gas is introduced into the reaction chamber so that the plasma in the chamber becomes a reactive plasma. The plasma reacts with the sample surface to produce volatile by-products, which are pumped out by the vacuum pump. Physical and chemical reactions between high-energy plasma particles and the material surface are used to activate, etch and decontaminate the material surface, improving various surface properties such as the friction coefficient, adhesion and hydrophilicity. The above explains the working principle of plasma cleaners. We hope you find it helpful. If you would like to learn more about plasma cleaners, you are welcome to consult our online customer service or call our service hotline (at the top right of the website). We will wholeheartedly provide you with quality service!

As an emerging type of cleaning equipment, the plasma cleaner can effectively treat contaminants on product surfaces and improve the surface properties of materials. As customer demand has grown, automation functions have been added to existing plasma cleaning technology, together with an automatic cleaning mode for integrated circuit templates; this is what we call the in-line plasma cleaner. The in-line plasma cleaner actually follows the stand-alone plasma cleaning mode but uses a fully automatic operating mode and can be linked with upstream and downstream production processes. It therefore largely meets customers' requirements for large-scale production, ensuring quality while also meeting the needs of mass production. Another of its biggest features is that it reduces manual operating costs and raises the level of equipment automation. In-line plasma cleaner product overview: 1. Customizable equipment dimensions 2. A variety of wide nozzles available as options, suitable for different products and processing environments 3. Low maintenance costs and long service life, greatly reducing costs 4. Fully automated operation, reducing labor and increasing output

Plasma cleaners have many advantages: they are highly intelligent and use very advanced technology, so they offer high precision, especially in time control; they work in a special environment and do not pollute the environment. As a result, their range of applications is very wide. Today we will take a detailed look at where plasma cleaners are used. 1. Rubber and plastics industry. In this field, plasma cleaners are mainly used in the rubber industry. Some rubber and plastic parts are very difficult to bond when their surfaces are joined, because some rubber and plastic materials are non-polar. Without surface treatment, printing and bonding results on them are very poor, and the parts may not be usable at all. After these materials are treated with a plasma cleaner, however, the structural surface of the materials is maximized on the one hand, and an active layer is formed on the other, so the results of bonding and printing are very good. This is an effect that other methods cannot achieve. 2. Automotive industry. As the economy develops, consumers have ever higher requirements for vehicle performance, such as handling comfort, appearance and durability. To meet these requirements, automakers use plasma cleaners to treat control panels before bonding and some interior parts before insertion, and also to treat door and window seals so that they perform well in service. Plasma cleaners have a great many fields of application. Besides the automotive and rubber industries, they are also widely used with metals, glass, composite materials and more. In the automotive industry, they can also be applied to ignition coils and engine oil seals, allowing these parts to deliver their full performance.

With the continuous development of microelectronics technology, processor chips run at ever higher frequencies, offer ever more powerful functions and have ever more pins, while chip feature sizes keep shrinking and package sizes keep changing. To improve product performance, in-line plasma cleaning equipment is gradually becoming widespread. So what does this equipment consist of, and how does it work on the production line? In-line plasma cleaner — in-line plasma cleaning equipment offers low cost, ease of use, low maintenance cost and environmental friendliness. Its substrate surface treatment is mainly aimed at IC packaging production processes, such as wire bonding and flip-chip packaging. It automatically takes flexible boards out of the magazine and plasma-cleans them, removing contamination from the material surface without human intervention. Since this equipment is so effective, let's take a detailed look at the process flow of in-line plasma cleaning equipment: (A) Four magazines filled with flexible boards are placed on the load/unload platform, and the pusher pushes the front strip out onto the loading/unloading conveyor system. (B) The loading/unloading conveyor system transfers the strip, via pinch rollers and belt conveyance, onto the upper stage of the material exchange platform, where it is positioned by the strip-shifting system. (C) The stage holding the received strip is exchanged to a position below the plasma reaction chamber, and the lifting system closes the vacuum chamber, pumps it down and plasma-cleans the strip. While the upper stage is moved to the cleaning position, the lower stage is moved to the loading position to receive the second layer of strips. When the upper stage has finished cleaning, it swaps positions with the lower stage: the lower stage is plasma-cleaned, while the upper stage moves to the loading position to return its strip. (D) The strips on the material exchange platform are shifted by the strip-shifting system onto the loading/unloading conveyor system and returned to the magazine via pinch rollers and belt, completing one cycle. The pusher mechanism then pushes out the next layer of strips for the next cycle. In-line plasma cleaners and their processes are being used more and more widely in IC packaging, and with their excellent process performance they have driven rapid technological development in the microelectronics industry. In line with the needs of modern high technology, in-line plasma cleaning technology will continue to raise its technical level, improve product performance and expand into more application areas.

As an emerging type of cleaning equipment, the plasma cleaner can effectively treat contaminants on product surfaces and improve the surface properties of materials. As customer demand has grown, automation functions have been added to existing plasma cleaning technology, together with an automatic cleaning mode for integrated circuit templates; this is what we call the in-line plasma cleaner. The in-line plasma cleaner actually follows the stand-alone plasma cleaning mode but uses a fully automatic operating mode and can be linked with upstream and downstream production processes. It therefore largely meets customers' requirements for large-scale production, ensuring quality while also meeting the needs of mass production. Another of its biggest features is that it reduces manual operating costs and raises the level of equipment automation. In-line plasma cleaner product overview: 1. Customizable equipment dimensions 2. A variety of wide nozzles available as options, suitable for different products and processing environments 3. Low maintenance costs and long service life, greatly reducing costs 4. Fully automated operation, reducing labor and increasing output What are the typical applications of in-line plasma cleaners? 1. Pretreatment before wire bonding, packaging and soldering in the semiconductor industry; 2. Pretreatment before screen printing in general industry; 3. In the electronics industry, pretreatment before phone case printing and coating, surface treatment of phone screens, etc.; 4. Chip bonding processes and flip-chip packaging processes; Whether atmospheric plasma cleaners or in-line plasma cleaners, they all aim to treat products better and achieve better results. The in-line plasma cleaner simply adds a fully automated mode on the original basis, which not only reduces labor costs but also ensures the treatment results of products. In recent years, in-line plasma cleaners have increasingly been put to use in all kinds of industrial cleaning applications. This reflects the development of plasma cleaning technology and also drives technological progress across industries.

Plasma cleaning equipment comes in two main types: batch and in-line. In-line plasma cleaning uses an automated cleaning method and is suited to large-scale production lines; it saves manpower, reduces labor costs and greatly improves cleaning efficiency, giving it the most pronounced advantages. In-line plasma cleaning before die attach Voids in die attach are a common problem in the packaging process. This is because untreated surfaces carry large amounts of oxides and organic contaminants, which lead to incomplete die attach, reduce the heat dissipation capability of the package, and have a major impact on package reliability. Before die attach, in-line plasma cleaning for several tens of seconds with a gas mixture of O2, Ar and H2 can remove organic oxides and metal oxides from device surfaces, increase the surface energy of the material, promote adhesion, reduce voids and greatly improve die attach quality. In-line plasma cleaning before wire bonding Wire bonding is the most common and most effective interconnection process between the chip and the external package. Statistics show that about 70% or more of product failures are caused by bonding failures. This is because impurity contamination on the bond pads and thick-film conductors is a major cause of reduced bondability and reliability in wire bonding. Contamination can come from every stage, including the chip, the capillary and the gold wire. If bonding is carried out directly without timely cleaning, defects such as non-stick bonds, bond lift-off and low bond strength will result. In-line plasma cleaning for several tens of seconds with a gas mixture of Ar and H2 can make the contaminants react to form volatile carbon dioxide and water. Because the cleaning time is short, the contaminants are removed without damaging the passivation layer around the bond area. Therefore, in-line plasma cleaning can effectively remove contaminants from the bond area, improve adhesion in the bond area, enhance bond strength and greatly reduce the bonding failure rate. As microelectronic packaging moves toward miniaturization, surface cleaning requirements are becoming ever higher. The many advantages of in-line plasma cleaning will make it one of the best options for surface cleaning; as the cleaning method with the greatest development potential, it will be applied in more and more fields. At the same time, in-line plasma cleaning is highly beneficial to environmental protection, as it produces no harmful pollutants after cleaning, which makes it all the more important at a time when the whole world places great emphasis on environmental awareness.

In our work and daily lives, we inevitably need to clean clothes and all kinds of items. People's cleaning methods have evolved from hand washing, to washboards and brushes, to washing machines, and now to intelligent, automated cleaning equipment, spanning a very long period of time. The plasma cleaner goes a step further, raising cleanliness at the level of ion cleaning. So what are the features of a plasma cleaner? 1. It uses a numerically controlled automation system with a high degree of automation. For large-scale and batch cleaning, you only need to enter the relevant parameters into the program set in the system to achieve automated cleaning of the target items, efficiently and without hassle. 2. Its precise control system and devices deliver very accurate time control. Cleaning of target items generally has certain time requirements: if the cleaning time is too short, cleanliness is insufficient; if it is too long, the items may be damaged. A plasma cleaner with strict control over time therefore meets customers' needs very well. 3. Compared with traditional cleaning machines, using a plasma cleaner does not cause physical damage to the surface of the target items, so surface quality is well assured. 4. It effectively prevents secondary contamination of the cleaned surface. With traditional cleaning machines, the cleanliness of items is easily affected by residual wastewater or repeated absorption, as well as by contact with air. The plasma cleaner's entire working process takes place in a vacuum, effectively ensuring the cleanliness of the target items. Of course, the plasma cleaner has more features than these; simply visit our official website to learn more about our products. Plasma cleaners play a very important role in cleaning items in many manufacturing fields as well as in experimental research.

Today, many materials are treated with an in-line plasma cleaner before bonding to change their surface properties and improve adhesion. An in-line plasma cleaner can clean the surface of materials. After treatment with plasma cleaning technology, there is a marked before-and-after difference, which helps the subsequent bonding process; plasma cleaning technology is not only simple to operate but also low in cost. Plasma surface modification can be carried out on the surfaces of various materials before spraying, improving the spraying results. For example, some chemical materials can be cleaned with an in-line plasma cleaner to modify the material surface and improve its hydrophilicity and hydrophobicity, facilitating the subsequent coating process and improving coating effect and quality. The in-line plasma cleaner offers in-line production capability and can be fully automated. It is a highly environmentally friendly processing method and can be used essentially without restriction for the surface treatment of powders, small parts, thin sheets, nonwovens, textiles, hoses, cavity interiors, printed circuit boards and more. An in-line plasma cleaner can effectively remove microscopic contaminants such as organic and inorganic matter adhering to object surfaces and improve the hydrophilicity of product surfaces, thereby enhancing the quality of processes such as bonding, coating and plating and substantially raising product yield. In-line plasma cleaners can clean, activate and coat the surfaces of all kinds of materials, achieving complete cleaning or modification without damaging the object surface. In-line plasma cleaning technology introduces a variety of oxygen-containing groups, transforming the surface from non-polar and difficult to bond to somewhat polar, easy to bond and hydrophilic, which benefits bonding, coating and printing. The method is simple and easy to implement, with fast processing speed, good treatment results, low environmental pollution and energy savings.

The cleaning principle of the in-line plasma cleaner: Plasma is a state of matter. Matter usually exists in three states: solid, liquid and gas. Under certain special conditions, however, a fourth state exists, such as the matter in the ionosphere of the Earth's atmosphere. The following are present in the plasma state: electrons moving at high speed; neutral atoms, molecules and radicals in an activated state; ionized atoms and molecules; unreacted molecules and atoms; and so on. Overall, however, the matter remains electrically neutral. In the vacuum chamber, an RF power supply ignites a glow discharge at a certain pressure, generating high-energy, disordered plasma, which bombards the surface of the product being cleaned to achieve the cleaning purpose. In-line plasma cleaners are typically used for: 1. Plasma surface activation/cleaning. 2. Adhesive bonding after plasma treatment. 3. Plasma etching/activation. 4. Plasma descum. 5. Plasma coating/plating (hydrophilic, hydrophobic). 6. Enhanced bondability. 7. Plasma coating. 8. Plasma ashing, surface modification and similar applications. This treatment can improve the wettability of material surfaces, enabling a wide range of materials to be coated, plated and so on, enhancing adhesion and bonding strength, while also removing organic contaminants, oil stains or grease. In-line plasma cleaners are currently widely used in electronics, communications, automotive, textiles, biomedicine and other fields. Examples include, in electronic products: coating treatment of LCD/OLED screens, pre-bonding treatment of PC plastic frames, surface treatment before spray painting and silk-screen printing of structural parts such as housings and keys, desmearing and cleaning of PCB surfaces, treatment of lenses before adhesive bonding, and treatment of wires and cables before inkjet coding; in the automotive industry, treatment of headlamp covers, brake pads and door sealing strips before bonding; in the machinery industry, fine, harmless cleaning of metal parts; treatment of lenses before coating; treatment of various industrial materials before joining and sealing; surface modification of three-dimensional objects… and so on.