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To ensure the reliability of copper lead frames (i.e. copper brackets) during wire bonding and molding and to improve yield, plasma cleaners are usually used to plasma-clean copper lead frames. The effectiveness of plasma treatment is affected by multiple factors. In the past, attention has mostly focused on the copper lead frames themselves and on the plasma cleaner selected and its parameters, but in fact several aspects of the magazine itself can also have a considerable impact on plasma treatment results. 1. Size and specifications Copper lead frames of different sizes and specifications are used with magazines of different sizes, and magazine size has a certain bearing on plasma cleaning results. Generally speaking, the larger the magazine, the longer it takes for the plasma to get inside it, which affects the uniformity and effectiveness of the plasma treatment. 2) Spacing Spacing here mainly refers to the distance between the layers of copper lead frames. The smaller the spacing, the poorer the effectiveness and uniformity of plasma cleaning of the copper lead frames. 3) Slot characteristics When copper lead frames are placed in a magazine for plasma cleaning, if none of the four sides is slotted, the frames will be shielded and it will be difficult for the plasma to get in, affecting the treatment results. At the same time, the shielding effect, the position of the slots and the size of the slots also need to be considered. In addition, whether the magazine lid should be closed, and when it should be closed, both affect plasma cleaning results.

Conference agenda Sharing industry information, industry updates, development trends and solutions with you: sharing together, and growing together every step of the way 2020-10-28 Conference check-in 2020-10-29 Summit forum October 29, 2020 Thursday Venue: International Hall B, 3rd Floor, Hefei Fengda International Hotel Summit forum Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association Time Topic 09:00-09:10 Addresses by leaders Provincial and municipal leaders Ye Tianchun, President of the Institute of Integrated Circuit Innovation, Chinese Academy of Sciences (in preparation); Chief Technical Expert of National Science and Technology Major Project 02; Vice Chairman of the China Semiconductor Industry Association Jin Lei, Director of the Basic Products Division, Department of Electronic Information, Ministry of Industry and Information Technology 09:10-09:25 Presentation on Hefei's investment environment and the Integrated Circuit Industrial Park of the Hefei Economic and Technological Development Zone Chen Nana, Investment Promotion Bureau, Hefei Economic and Technological Development Zone 09:25-09:30 Unveiling ceremony of the Hefei Semiconductor High-end Equipment and Components Industrial Park 09:30-09:35 Group signing ceremony for Hefei semiconductor projects Invited presentations 09:35-09:55 China's semiconductor equipment: review and outlook Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association 09:55-10:15 (Topic to be confirmed) Dr. Wang Houliang, Party Secretary and Executive Deputy General Manager, ChangXin Memory Technologies, Inc. 10:15-10:30 Tea break and exhibition networking 10:30-10:50 Moving forward together to build a semiconductor equipment industry ecosystem Zhou Yang, Vice President, Beijing NAURA Microelectronics Equipment Co., Ltd. 10:50-11:10 Discussion of several strategic issues in accelerating the development of the semiconductor equipment industry Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China 11:10-11:30 Opportunities and challenges of III-V nitride epitaxy technology Dr. Hao Maosheng, General Manager, Shanghai Xinyuanji Semiconductor Technology Co., Ltd. 11:30-11:50 (Topic to be confirmed) Zhang Yue, Founder and Chairman, Hefei Yuexin Technology Co., Ltd. 11:50-12:10 Development trends and outlook of China's semiconductor equipment industry Wang Hui, President of the Semiconductor Equipment Branch, China Electronics Production Equipment Industry Association; Chairman, ACM Research (Shanghai), Inc. 12:10-13:20 Buffet lunch Moderator: Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China 13:20-13:40 HYBRID BONDING SOLUTION: hybrid bonding, a solution for heterogeneous packaging Gong Li, General Manager China, SUSS 13:40-14:00 Water quality analysis and control for wet process equipment Ma Tan, Sales Manager, Microelectronics Industry, METTLER TOLEDO 14:00-14:20 Joint development model for international high-precision nm-scale semiconductor equipment, and experience sharing Dr. Zeng Xu, Vice President, Asia-Pacific Semiconductor Division, Jiangsu Jicui Sukesi Technology Co., Ltd. 14:20-14:40 Domestic production of semiconductor packaging dicing technology Qian Lixin, Deputy General Manager, Advanced Microelectronic Equipment (Zhengzhou) Co., Ltd. 14:40-15:00 A new model for R&D collaboration on equipment and materials in the More than Moore field Feng Li, Deputy General Manager, Shanghai Industrial Microtechnology Research Institute 15:00-15:20 Introduction to flowmeters for semiconductor equipment Yang Changlin, Department Manager, Tokyo Keiso Co., Ltd.; General Manager, Tokyo Keiso (Beijing) Instruments Co., Ltd. 15:20-15:40 Tea break and exhibition networking 15:40-16:00 Micro-electromechanical casting: a clean, efficient wafer-level thick metal deposition technology Dr. Gu Jiebin, CEO, Shanghai Maizhu Semiconductor Technology Co., Ltd.; Associate Research Fellow, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences 16:00-16:20 Advanced packaging innovations in communication networks and the mobile internet Li Bin, General Manager China, Besi 16:20-16:40 Current status and future technology roadmap of domestic semiconductor packaging equipment Fang Tangli, Manager, Semiconductor Technology Department, Anhui Naike Equipment Technology Co., Ltd. 16:40-17:00 Interpretation of the insurance compensation policy for first-of-its-kind (first unit/set) major technical equipment Yue Wei, Product Director, Special Risks Department, Ping An Property & Casualty Insurance Company of China, Ltd. 17:00-17:20 Some insights from developing core components for domestic IC equipment Yan Yue, General Manager, Shanghai Jijia Electronic Technology Co., Ltd. 17:20-17:40 (Topic to be confirmed) Tongfu Microelectronics Co., Ltd. 18:10-20:30 Reception dinner. Supported by: Shanghai Micro Electronics Equipment (Group) Co., Ltd. 2020-10-30 Thematic forum October 30, 2020 International Hall B, 3rd Floor, Hefei Fengda International Hotel Thematic forum on the coordinated development of the semiconductor equipment industry chain Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association 9:00-9:25 Shuoke Zhongkexin full-range ion implanter solutions Zeng Ansheng, Marketing and Process Director, Beijing Shuoke Zhongkexin Electronics Equipment Co., Ltd. 9:25-9:50 Applications of transparent anti-static resin sheets in electronic engineering Zhang Jingchun, Chief Technical Engineer, Suzhou Fulang Optical Materials Co., Ltd.; Member, China Electrostatic Standardization Committee 9:50-10:15 Win-win cooperation to create core value: power supply trends for semiconductor equipment and high-reliability power supply application cases Yuan Chong, Marketing Manager, TDK-Lambda (China) Electronics Co., Ltd. 10:15-10:35 Tea break and exhibition networking 10:35-10:50 Opportunities and challenges for domestic semiconductor equipment Jiang Tingming, Vice President, Shanghai Zhichun Technology 10:50-11:15 Domestic production of key equipment for IC advanced packaging Dr. Ye Lezhi, Senior Engineer and Technical Director, Beijing CETC Electronic Equipment Co., Ltd. 11:15-11:40 Research on diamond-based composite materials for chip thermal management Li Zhengxian, Chairman, Shanghai Zhuojing Semiconductor Technology Co., Ltd. 11:40-12:05 Progress in the domestic production of large-size fully automatic precision dicing equipment Yang Yunlong, Chairman and President, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. 12:05-13:30 Buffet lunch 13:30-13:55 DISCO DIS100 fully automatic chip inspection system Shu Yayun, Product Manager, DISCO Technology (China) Co., Ltd. 13:55-14:20 Opportunities and challenges for high-volume manufacturing (HVM) semiconductor inspection and metrology equipment Dr. Zhang Xuena, Chairman and General Manager, Beijing Aixin Semiconductor Technology Co., Ltd. 14:20-14:45 The urgency of industry-university-research-user collaboration for a self-reliant, controllable Chinese semiconductor equipment industry Wang Chi, Chairman/Founder, Suzhou Aikeruisi Intelligent Equipment Co., Ltd. 14:45-15:10 Challenges facing failure analysis as advanced integrated circuits develop Dr. Chen Zhirong, Assistant Vice President, Engineering Division, Weisibo Testing Technology (Hefei) Co., Ltd. 15:10-15:35 Tea break and exhibition networking 15:35-15:50 Market applications of new electronic devices, and lithography-area (yellow light) wet process equipment Wang Gang, General Manager, Ningbo Runhua Quanxin Microelectronics Equipment Co., Ltd. 15:50-16:15 Applications of PSP 3D imaging and AI vision technology in the semiconductor packaging industry Lin Guicheng, Sales Director, Hefei Tuxun Electronic Technology Co., Ltd. 16:15-16:40 Latest business developments of global semiconductor equipment companies Yang Shaohui, Chief Analyst, Research Department, BOC International Securities

From October 14 to 16, the 2020 Global Semiconductor Industry (Chongqing) Expo was held at the Chongqing International Expo Center. Themed “‘Chip’ Power, New Development”, the expo brought together more than 300 well-known companies from China and abroad, including Alpha and Omega Semiconductor, Siemens, Pingwei Group, United Microelectronics Center, Huada, China Resources Microelectronics and CISDI, with an exhibition area of 15,000 square meters. Through forums, exhibition displays and other means, our company held friendly communication and discussions with customers on chamber/batch plasma cleaners and in-line plasma cleaners (online/inline plasma cleaning machine), learning about customers' needs and concerns. We will continue to improve product quality and broad adaptability, keep pace with industry technology, and provide customers with high-quality products and solutions.

The company's core team has been engaged in plasma cleaning and surface treatment research for more than ten years, and its products are widely used in processes such as IC packaging, LED packaging, LCD mounting, component packaging, thick-film circuit packaging and engineering plastic surface treatment. With the fully automatic plasma (in-line plasma) cleaners we produce, product reliability and yield are significantly improved compared with traditional methods, while both performance and throughput are superior to imported equipment, offering good cost-effectiveness. In addition to standard plasma cleaning equipment, we can also customize large, medium and small vacuum chamber plasma cleaning equipment to customers' specific requirements to meet their surface treatment needs for different products, as well as customize various On-line mode plasma cleaning equipment that links upstream and downstream with customers' production lines, reducing human involvement and achieving highly automated production lines.