The 8th China Semiconductor Equipment Annual Conference will be held in Hefei on October 28-30
Conference agenda
Sharing industry information, industry updates, development trends and solutions with you: sharing together, and growing together every step of the way
2020-10-28
Conference check-in
2020-10-29
Summit forum
October 29, 2020 Thursday
Venue: International Hall B, 3rd Floor, Hefei Fengda International Hotel
Summit forum
Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
Time
Topic
09:00-09:10
Addresses by leaders
Provincial and municipal leaders
Ye Tianchun, President of the Institute of Integrated Circuit Innovation, Chinese Academy of Sciences (in preparation); Chief Technical Expert of National Science and Technology Major Project 02; Vice Chairman of the China Semiconductor Industry Association
Jin Lei, Director of the Basic Products Division, Department of Electronic Information, Ministry of Industry and Information Technology
09:10-09:25
Presentation on Hefei's investment environment and the Integrated Circuit Industrial Park of the Hefei Economic and Technological Development Zone
Chen Nana, Investment Promotion Bureau, Hefei Economic and Technological Development Zone
09:25-09:30
Unveiling ceremony of the Hefei Semiconductor High-end Equipment and Components Industrial Park
09:30-09:35
Group signing ceremony for Hefei semiconductor projects
Invited presentations
09:35-09:55
China's semiconductor equipment: review and outlook
Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
09:55-10:15
(Topic to be confirmed)
Dr. Wang Houliang, Party Secretary and Executive Deputy General Manager, ChangXin Memory Technologies, Inc.
10:15-10:30
Tea break and exhibition networking
10:30-10:50
Moving forward together to build a semiconductor equipment industry ecosystem
Zhou Yang, Vice President, Beijing NAURA Microelectronics Equipment Co., Ltd.
10:50-11:10
Discussion of several strategic issues in accelerating the development of the semiconductor equipment industry
Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China
11:10-11:30
Opportunities and challenges of III-V nitride epitaxy technology
Dr. Hao Maosheng, General Manager, Shanghai Xinyuanji Semiconductor Technology Co., Ltd.
11:30-11:50
(Topic to be confirmed)
Zhang Yue, Founder and Chairman, Hefei Yuexin Technology Co., Ltd.
11:50-12:10
Development trends and outlook of China's semiconductor equipment industry
Wang Hui, President of the Semiconductor Equipment Branch, China Electronics Production Equipment Industry Association; Chairman, ACM Research (Shanghai), Inc.
12:10-13:20
Buffet lunch
Moderator: Cao Liansheng, Vice President, Advanced Micro-Fabrication Equipment Inc. China
13:20-13:40
HYBRID BONDING SOLUTION: hybrid bonding, a solution for heterogeneous packaging
Gong Li, General Manager China, SUSS
13:40-14:00
Water quality analysis and control for wet process equipment
Ma Tan, Sales Manager, Microelectronics Industry, METTLER TOLEDO
14:00-14:20
Joint development model for international high-precision nm-scale semiconductor equipment, and experience sharing
Dr. Zeng Xu, Vice President, Asia-Pacific Semiconductor Division, Jiangsu Jicui Sukesi Technology Co., Ltd.
14:20-14:40
Domestic production of semiconductor packaging dicing technology
Qian Lixin, Deputy General Manager, Advanced Microelectronic Equipment (Zhengzhou) Co., Ltd.
14:40-15:00
A new model for R&D collaboration on equipment and materials in the More than Moore field
Feng Li, Deputy General Manager, Shanghai Industrial Microtechnology Research Institute
15:00-15:20
Introduction to flowmeters for semiconductor equipment
Yang Changlin, Department Manager, Tokyo Keiso Co., Ltd.; General Manager, Tokyo Keiso (Beijing) Instruments Co., Ltd.
15:20-15:40
Tea break and exhibition networking
15:40-16:00
Micro-electromechanical casting: a clean, efficient wafer-level thick metal deposition technology
Dr. Gu Jiebin, CEO, Shanghai Maizhu Semiconductor Technology Co., Ltd.; Associate Research Fellow, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
16:00-16:20
Advanced packaging innovations in communication networks and the mobile internet
Li Bin, General Manager China, Besi
16:20-16:40
Current status and future technology roadmap of domestic semiconductor packaging equipment
Fang Tangli, Manager, Semiconductor Technology Department, Anhui Naike Equipment Technology Co., Ltd.
16:40-17:00
Interpretation of the insurance compensation policy for first-of-its-kind (first unit/set) major technical equipment
Yue Wei, Product Director, Special Risks Department, Ping An Property & Casualty Insurance Company of China, Ltd.
17:00-17:20
Some insights from developing core components for domestic IC equipment
Yan Yue, General Manager, Shanghai Jijia Electronic Technology Co., Ltd.
17:20-17:40
(Topic to be confirmed)
Tongfu Microelectronics Co., Ltd.
18:10-20:30
Reception dinner. Supported by: Shanghai Micro Electronics Equipment (Group) Co., Ltd.
2020-10-30
Thematic forum
October 30, 2020 International Hall B, 3rd Floor, Hefei Fengda International Hotel
Thematic forum on the coordinated development of the semiconductor equipment industry chain
Moderator: Jin Cunzhong, Executive Deputy Secretary-General, China Electronics Production Equipment Industry Association
9:00-9:25
Shuoke Zhongkexin full-range ion implanter solutions
Zeng Ansheng, Marketing and Process Director, Beijing Shuoke Zhongkexin Electronics Equipment Co., Ltd.
9:25-9:50
Applications of transparent anti-static resin sheets in electronic engineering
Zhang Jingchun, Chief Technical Engineer, Suzhou Fulang Optical Materials Co., Ltd.; Member, China Electrostatic Standardization Committee
9:50-10:15
Win-win cooperation to create core value: power supply trends for semiconductor equipment and high-reliability power supply application cases
Yuan Chong, Marketing Manager, TDK-Lambda (China) Electronics Co., Ltd.
10:15-10:35
Tea break and exhibition networking
10:35-10:50
Opportunities and challenges for domestic semiconductor equipment
Jiang Tingming, Vice President, Shanghai Zhichun Technology
10:50-11:15
Domestic production of key equipment for IC advanced packaging
Dr. Ye Lezhi, Senior Engineer and Technical Director, Beijing CETC Electronic Equipment Co., Ltd.
11:15-11:40
Research on diamond-based composite materials for chip thermal management
Li Zhengxian, Chairman, Shanghai Zhuojing Semiconductor Technology Co., Ltd.
11:40-12:05
Progress in the domestic production of large-size fully automatic precision dicing equipment
Yang Yunlong, Chairman and President, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
12:05-13:30
Buffet lunch
13:30-13:55
DISCO DIS100 fully automatic chip inspection system
Shu Yayun, Product Manager, DISCO Technology (China) Co., Ltd.
13:55-14:20
Opportunities and challenges for high-volume manufacturing (HVM) semiconductor inspection and metrology equipment
Dr. Zhang Xuena, Chairman and General Manager, Beijing Aixin Semiconductor Technology Co., Ltd.
14:20-14:45
The urgency of industry-university-research-user collaboration for a self-reliant, controllable Chinese semiconductor equipment industry
Wang Chi, Chairman/Founder, Suzhou Aikeruisi Intelligent Equipment Co., Ltd.
14:45-15:10
Challenges facing failure analysis as advanced integrated circuits develop
Dr. Chen Zhirong, Assistant Vice President, Engineering Division, Weisibo Testing Technology (Hefei) Co., Ltd.
15:10-15:35
Tea break and exhibition networking
15:35-15:50
Market applications of new electronic devices, and lithography-area (yellow light) wet process equipment
Wang Gang, General Manager, Ningbo Runhua Quanxin Microelectronics Equipment Co., Ltd.
15:50-16:15
Applications of PSP 3D imaging and AI vision technology in the semiconductor packaging industry
Lin Guicheng, Sales Director, Hefei Tuxun Electronic Technology Co., Ltd.
16:15-16:40
Latest business developments of global semiconductor equipment companies
Yang Shaohui, Chief Analyst, Research Department, BOC International Securities
